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NTR4170N
Power MOSFET
30 V, 3.1 A, Single N ? Channel, SOT ? 23
Features
? Low R DS(on)
? Low Gate Charge
? Low Threshold Voltage
? Halide Free
? This is a Pb ? Free Device
Applications
? Power Converters for Portables
? Battery Management
? Load/Power Switch
V (BR)DSS
30 V
http://onsemi.com
R DS(on) MAX
55 m W @ 10 V
70 m W @ 4.5 V
110 m W @ 2.5 V
I D MAX
3.1 A
2.8 A
2.0 A
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
SIMPLIFIED SCHEMATIC ? N ? CHANNEL
Parameter
Symbol
Value
Unit
D
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage
Continuous Drain
Current (Note 1)
Steady
State
V DSS
V GS
30
± 12
2.4
V
V
G
t ≤ 30 s
t ≤ 10 s
Steady
State
T A = 25 ° C
I D
3.1
3.9
1.7
A
S
MARKING DIAGRAM/
PIN ASSIGNMENT
Power Dissipation
(Note 1)
t ≤ 30 s
t ≤ 10 s
Steady
State
t ≤ 30 s
t ≤ 10 s
T A = 85 ° C
T A = 25 ° C
P D
P D
2.3
2.8
0.48
0.82
1.25
W
1
3
2
SOT ? 23
CASE 318
STYLE 21
3
Drain
TREM G
G
1
1 2
Gate Source
Pulsed Drain Current t p = 10 m s
Operating Junction and Storage Temperature
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
I DM
T J ,
T stg
I S
T L
8.0
? 55 to
150
0.82
260
A
° C
A
° C
TRE = Specific Device Code
M = Date Code
G = Pb ? Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL RESISTANCE RATINGS
Parameter Symbol Max Unit
Device
NTR4170NT1G
NTR4170NT3G
Package
SOT ? 23
(Pb ? Free)
SOT ? 23
(Pb ? Free)
Shipping ?
3000/Tape & Reel
10000/Tape & Reel
Junction ? to ? Ambient ? Steady State (Note 1)
Junction ? to ? Ambient ? t ≤ 30 s
Junction ? to ? Ambient ? t < 10 s (Note 1)
R q JA
R q JA
R q JA
260
153
100
° C/W
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
1. Surface ? mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces).
? Semiconductor Components Industries, LLC, 2012
June, 2012 ? Rev. 1
1
Publication Order Number:
NTR4170N/D
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